| 반도체,
LCD 제조 및 청정실 운영 환경 관련 장비 |
|
입자 샘플 및 침적 시스템
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MSP Corp
<Particle Sample & Deposition System> |
| Description of
Products |
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2000 and 2010 Ultrapure Cleanroom Foggers™
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특징
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1. Air flow visualization
in cleanroom
2. Exhaust and ventilation studies
3. High purity DI water fog
4. High fog density
5. Truly non-contaminating
6. No measurable residue upon evaporation of water droplets
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사양
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Model
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2000
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2010
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Boiler capacity
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3 liters
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2 liters
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Dewar capacity
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9 liters
6.4 kg LN2
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3 liters
2.2 kg LN2
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Power
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115 VAC,
60 Hz, 14 A
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115 VAC,
60 Hz, 10 A
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Optional
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230 VAC,
50 Hz, 8 A
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230 VAC,
50 Hz, 6 A
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Dimension
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609x432x1142 mm
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380x300x300 mm
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(LxWxH)
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24"x17"x45"
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15"x12"x12"
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Weight
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43 kg (95 lb)
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15 kg (33 lb)
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2045 High-Output PSL Aerosol Generator
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특징
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1. High PSL output
at 7.2 x 1010/min for 0.10-μm PSL
2. 1 x 108 per ft3 PSL sphere challenge in 720 cfm of air for
testing 2' x 4' filters at 90 ft/min face velocity
3. For testing ULPA filters at 99.9999% efficiency , Low PSL
consumption
4. Rugged design, high quality stainless steel atomizer for
industrial application |
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사양
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1. PSL sphere size
range 0.1 - 0.5 mm
2. PSL output rate 7.2 x 1010 per min @ 0.10 mm
3. Output flow rate 8 scfm
4. Compressed air(or N2) 8scfm, @ 80-100psig
5. Remote control option 115VAC, 60Hz, 2A
6. Dimensions (L x W x H) 18" x 12" x 20" |
| 2110 Cleanroom
Cascade Impactor |
|
특징
|
1. Six-stage cascade
impactor
2. Collect particles from 0.05-10μm
3. 3L/min sampling flow rate
4. 10 mm x 10 mm silicon wafer substrate
5. For single particle analysis by SEM, AFM, EDX, Auger, SIMS,
and other analytical techniques
6. Detachable impactor for remote sampling
7. Small quite pump
8. 7-day solid state timer with 14 programmable starts and stops
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사양
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1. Sampling flow rate
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3 L/min
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2. Impactor cut-point
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10, 3, 1, 0.3, 0.1 and 0.05 mm
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3. Power
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115 VAC, 60 Hz, 2 A
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4. Dimensions(L x W x H)
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230 x 240 x 300 mm
(9.1" x 9.5" x 11.8")
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5. Weight
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4 kg (9 lb)
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| 2300 PSL and Process
Particle Wafer Deposition System |
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특징
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1. Calibrate wafer
surface scanners
2. Evaluate wafer cleaning system
3. Fine tune cleaning recipe
4. 300mm wafer and 0.04μm(40nm) particle capability
5. Generate uniform-sized, real-world process particles by electrostatic
classification
6. Enhanced electrostatic deposition for increased deposition
speed
7. NIST-traceable particle sizing by electrical mobility
8. Electrostatic stripping of background haze particles during
PSL sphere and particle deposition |
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사양
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1. Wafer diameter
150-300 mm PSL deposition 0.08-2.0 mm, standard(0.04-4.0 mm
optional)
2. Particle material PSL spheres, metal (Cu, W, etc.), semiconductor
(Si), and dielectric (SiO2, TiO2, Al2O3, etc.)
3. Power 110VAC, 60 Hz, 15A (220VAC, 50 Hz, 10A optional)
4. Dimension (WxDxH) 820 x 610 x 1890 mm |
